Hanyang University in collaboration with Stanford University has succeeded in fabricating peel-and-stick thin film solar cells (TFSCs).
The Si wafer is clean and reusable. Moreover, as the peeled-off TFSCs from the Si wafer are thin, light-weight, and flexible, it can be attached onto any form or shape of surface like a sticker.
Professor Dong Rip Kim of the Department of Mechanical Engineering has succeeded in fabricating peel-and-stick thin film solar cells (TFSCs) with the collaboration of Stanford team led by Professor Xiaolin Zheng. This method makes possible the overcoming of hardships related to working with traditional solar cells, namely the lack of handling, high manufacturing cost, and limited flexibility while maintaining performance.
Kim is currently in charge of the Hanyang University Nanotechnology for Energy Conversion Lab. His research interests are solar cells, energy conversion devices using nanomaterials, flexible electronics, nanoelectronics, and nanosensors. Among Kim’s recent publications are “Peel-and-Stick: Fabricating Thin Film Solar Cell on Universal Substrates” in the journal ofScientific Reports, “Shrinking and Growing: Grain Boundary Density Reduction for Efficient Polysilicon Thin-Film Solar Cells” in the journal of Nano Letters, and “Thermal Conductivity in Porous Silicon Nanowire Arrays” in the journal ofNanoscale Research Letters.
For more on this article: http://www.sciencedaily.com/releases/2013/04/130409090746.htm
Source: Science Daily / University of Toronto